$292.09
225.6% vs S&P 12m
Business overview
Etch and deposition leader with outsized exposure to memory and 3D NAND process steps.
HBM stacking and advanced packaging multiply etch and deposition step counts, lifting Lam content per advanced wafer.
Composite score
Higher = stronger overall research case
Fundamental74
Technical84
Valuation20
AI relevance78
Risk-adjusted (higher = safer)49
Segment-relative fundamental percentile: 71
Synthetic 1Y price action
Deterministic price series; 50d (yellow) and 200d (orange) MAs shown
3M RS: 14.7%6M RS: 86.7%12M RS: 225.6%Vol30d: 52%DD52w: -2.4%
Financial summary
Curated, illustrative
Revenue
$21.68B
Growth (YoY)
23.8%
Gross margin
50.0%
Operating margin
35.0%
FCF
$4.35B
Capex
$2.60B
Net cash / (debt)
$1.02B
ROIC
22.8%
Customer conc.
Medium
Valuation
Market cap
$365.28B
Enterprise value
$364.26B
P/E (TTM)
55.2x
Forward P/E
36.8x
EV / Sales
16.8x
EV / EBITDA
46.4x
P / FCF
83.9x
PEG
1.7x
Rule of 40
—
Risks
Severity 1 (low) to 5 (severe)
- 4Memory cycle exposure
- 3China demand
Score components
What drove the composite
Growth77
Profitability90
Cash generation73
Balance sheet80
Moat / AI relevance75
Capital intensity (higher = lighter)55
Customer diversification60
Valuation discipline (dilution)65
Trend (MA50/MA200)95
Momentum (3/6/12m)79
Relative strength100
Realized vol (higher = lower vol)39
Segment peers
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