$31.69
195.9% vs S&P 12m
Business overview
Largest outsourced semiconductor assembly and test (OSAT) provider; expanding advanced packaging including 2.5D and fan-out.
Advanced packaging capacity is a binding constraint on AI accelerators. ASE's CoWoS/SoIC build-out captures spillover demand from TSMC.
Composite score
Higher = stronger overall research case
Fundamental51
Technical85
Valuation64
AI relevance65
Risk-adjusted (higher = safer)49
Segment-relative fundamental percentile: 25
Synthetic 1Y price action
Deterministic price series; 50d (yellow) and 200d (orange) MAs shown
3M RS: 28.4%6M RS: 110.3%12M RS: 195.9%Vol30d: 48%DD52w: -10.7%
Financial summary
Curated, illustrative
Revenue
$20.80B
Growth (YoY)
17.2%
Gross margin
18.5%
Operating margin
10.1%
FCF
$-2.05B
Capex
$6.97B
Net cash / (debt)
$-4.46B
ROIC
4.2%
Customer conc.
Medium
Valuation
Market cap
$69.53B
Enterprise value
$73.99B
P/E (TTM)
48.8x
Forward P/E
20.0x
EV / Sales
3.6x
EV / EBITDA
19.0x
P / FCF
—
PEG
5.0x
Rule of 40
—
Risks
Severity 1 (low) to 5 (severe)
- 3Margins thin vs. capex intensity
- 4Taiwan concentration
Score components
What drove the composite
Growth64
Profitability43
Cash generation23
Balance sheet71
Moat / AI relevance75
Capital intensity (higher = lighter)23
Customer diversification60
Valuation discipline (dilution)65
Trend (MA50/MA200)95
Momentum (3/6/12m)80
Relative strength100
Realized vol (higher = lower vol)43
Segment peers
Other companies in Packaging